Engineer - 6G RF Packaging

About the role

The Advanced Wireless Technology Lab in Ottawa is seeking an Engineer to lead 6G RF packaging research and development. You will work on cutting‑edge integration technologies and collaborate with RFIC, antenna, and materials specialists to create high‑performance wireless solutions.

Key responsibilities

• Explore 2.5D/3D integration, wafer‑level packaging, diverse interposers and embedded passives.
• Study low‑loss die‑to‑die and die‑to‑package interfaces, including micro‑bumps, vias and waveguide structures.
• Develop embedded shielding, isolation structures and localized cooling for high‑power RF arrays.
• Perform full‑wave EM simulations to quantify interconnect loss, leakage, coupling and noise.
• Coordinate VNA, thermal and OTA array measurements to evaluate system‑level package performance.
• Partner with internal specialists to frame cross‑disciplinary research and secure patents and publications.

Required profile

• PhD in Electrical Engineering, RF/Microwave Engineering, Packaging or related field (or equivalent advanced R&D experience).
• Minimum 5 years of relevant industry experience.
• Deep knowledge of RF/microwave principles and thermal management, CTE mismatch, stress and reliability testing.
• Hands‑on experience designing test vehicles and directing microelectronics assembly (PCB, flip‑chip, wire bonding, SMT, molding).

Required skills

• Full‑wave EM simulation and circuit simulation tools.
• Proficiency with RF lab equipment (VNAs) and probe stations.
• PCB design and assembly techniques (flip‑chip, wire bonding, SMT, molding).
• Thermal management analysis and reliability testing.