Packaging Engineer / Scientist – R&D

About the role

Excelitas Technologies is seeking a passionate Packaging Engineer to lead the development of semiconductor products such as lasers and photodetectors for a range of applications including automotive, medical, aerospace and defense. The role covers the full product life‑cycle from design through to production transfer and ongoing support.

Key responsibilities

• Design hermetic, quasi‑hermetic or non‑hermetic packages and create thermal and stress simulation models.
• Define assembly and test jigs, develop assembly processes and coordinate prototype builds.
• Produce manufacturing documentation (BOMs, routings, drawings) and plan product evaluation and qualification.
• Support transfer to production, negotiate specifications with suppliers and collaborate with product managers and application engineers.
• Perform cost, time and feasibility analyses for quote requests and attend customer liaison meetings.

Required profile

• Bachelor’s or Master’s degree in Mechanical, Electrical, Physics Engineering or equivalent.
• Proficiency with SolidWorks and knowledge of ANSYS.
• Experience with electro‑optical components, reliability testing and technology transfer.
• Strong data‑analysis skills and ability to work independently or in a team on multiple projects.
• Bilingual in French and English.

Required skills

• SolidWorks
• ANSYS
• Electro‑optical component handling
• Reliability testing
• Technology transfer documentation
• Data analysis
• Knowledge of TO, PCB, ceramic substrate and lead‑frame assembly technologies